Utility Menu

Powder/Bulk Solids

The Source for Dry Processing and Bulk Handling Technology

TAPPI PLACE Flexible Packaging Summit Set for Columbus, Ohio

January 5, 2009
The 2009 TAPPI PLACE Flexible Packaging Summit (Polymers, Laminations, Adhesives, Coatings and Extrusions) will be held April 28-30 in Columbus, Ohio. The event will include the two-day Consumer Packaging Solutions for Barrier Performance Course and the Symposium on Nanomaterials for Flexible Packaging.

The Consumer Packaging Solutions for Barrier Performance Course will include:
technical presentations dealing with the technology, materials, coatings, and processes that can be used to meet these product expectations; roundtable discussions with industry celebrities; interactive study sessions.

Expert speakers will lead sessions that address packaging requirements for snack/consumer packaging as well as the consumer packaging challenges for flexible snack food packaging and barrier requirements. Keynote presentations will be given by Ken Laverdure, packaging R&D, Sustainability and Advanced Materials Group, Frito-Lay North America, and Dan Feldmeier, senior associate principal engineer, Kraft Food/Oscar Mayer.

The Symposium on Nanomaterials for Flexible Packaging will cover the latest developments in nano barrier enhancement, the impact of anti-microbial nanotechnologies, the impact of active packaging, integrating intelligent packaging nanotechnologies with biodegradable films and food packages, as well as issues, challenges, and the future of nanomaterials for flexible packaging.

More details are available at www.tappi.org/09placesummit.

TAPPI is the leading association for the worldwide pulp, paper, packaging, and converting industries and co-publisher of Paper360°.