Laser and electron beam perforation permits openings from .001 in. in plate thickness from .008 to .118 in. Perforations can be conical holes or slots providing good material flow and high efficiency when screening. The company provides micro-perforated plates, processed to machine components, for a variety of screening and classifying applications, such as liquid-solid separation in centrifuges and screening applications of bulk and powder goods in chemical applications.
, Muncy, PA 570-329-6734 www.andritz.com/PerfTec